February 17, 2021

Worldwide Automotive Power Module Packaging Industry to 2026 – Asia-Pacific is Expected to Register the Highest Growth Rate – ResearchAndMarkets.com

DUBLIN–(BUSINESS WIRE)–The “Automotive Power Module Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering. The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 – 2026). Companies Mentioned Amkor Technology Kulicke and Soffa Industries Inc. PTI Technology Inc. Infineon Technologies STMicroelectronics Fuji Electric Co. Ltd. Toshiba Electronic Devi

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