January 13, 2021

Fibocom to Be The First in Providing Engineering Samples of 5G Module Based on MediaTek Chipset Platform

SHENZHEN, China–(BUSINESS WIRE)– #5G–Fibocom releases its new 5G module FG360 during the CES 2021, and will take the lead in providing ES of 5G module based on MediaTek chipset platform.


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