January 15, 2020

Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker

SAN JOSE, Calif.–(BUSINESS WIRE)– #5G–Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. “High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliabilit


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