July 1, 2019

Winbond Supports Accelerated Roll-Out of 5G CPE Modems With Release of 2Gb NAND+2Gb LPDDR4x Multi-Chip Package

TAICHUNG CITY, Taiwan–(BUSINESS WIRE)–<a href=”https://twitter.com/hashtag/2GbMCP?src=hash” target=”_blank”>#2GbMCP</a>–Winbond supports accelerated roll-out of 5G CPE modems with 1.8V, 149-ball Ball Grid Array (BGA), 2Gb NAND+2Gb LPDDR4x multi-chip package (MCP)

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