March 13, 2018

QSFP-DD MSA to release QSFP-DD Thermal White Paper During OFC 2018

SAN DIEGO, Calif.–(BUSINESS WIRE)–Molex, Cisco, Juniper Networks and other Multi Source Agreement (MSA)
group members will release a white paper focused on the Quad Form Factor
Pluggable Double Density (QSFP-DD) during the Optical Networking and
Communication Conference and Exhibition (OFC 2018), March 11-15, 2018 at
the San Diego (CA) Convention Center.

In total, 62 companies have come together in support of the QSFP-DD MSA
to address the industry need for a high-density, high-speed networking
solution. Established two years ago, the QSFP-DD MSA group accepted the
challenge to meet the market demand for a next generation high-density,
high-speed pluggable backwards compatible module form factor and has
succeeded in releasing a 3.0 Hardware specification with broad market
support that overcomes the technical challenges of specifying a QSFP28
compatible double-density interface.

The white paper addresses how the thermal performance of the QSFP-DD
module is evaluated for use in a high-performance data center
environment. Thermal test data is presented and analyzed showing
temperature rise versus air flow. Feasibility of 15W QDFP-DD modules is

“Building and sustaining the pipeline of interoperable interconnect
solutions is absolutely critical to support advances in transceiver
modules, switch technologies and servers,” said Scott Sommers, group
product manager, Molex. “Through QSFP-DD strategic collaborations, we
have provided the expertise needed within the industry to meet the
rising demands for high-speed network solutions.”

“Cisco has always had confidence in QSFP-DD being the right choice for
broad industry adoption as the market moves to 400GbE. This whitepaper
shows that any concerns with a system vendor’s ability to effectively
integrate and cool these modules into their networking products is
overblown,” said Mark Nowell, distinguished engineer, Cisco Data Center

“The QSFP-DD form factor with system cooling support of 15W of
dissipated power for data center applications is direct leverage of
industry knowledge gained over many generations of adoption of form
factor such as those defined by the SFF Committee and the CFP MSA along
with innovation in system air-flow characteristics. Thermal management
is seen primarily as a system responsibility, which leaves open
opportunity for even further innovation over system generation,” said
Jeffery Maki, distinguished engineer II, Juniper Networks.

For more information on the QSFP-DD module thermal management system
white paper, please visit

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