March 13, 2018

Kulicke & Soffa Further Extends China Presence

SINGAPORE–(BUSINESS WIRE)–Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”), announced today the official opening of their
China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was
established in 2002, spanning over 17,000 square meters, encompasses the
company’s equipment software and process engineering, R&D as well as
production lines for consumables products such as capillaries, blades
and wedge bonding tools.

The 1,200 square meters Demo Center houses a broad assembly line of the
latest K&S solutions, including RAPID™ Pro GEN-S (Smart) Series
ball bonder, OptoLux™ ball bonder for LED and APAMA™ DA (Die Attach)
equipment. Customers can now visit the site for demonstration of the
end-to-end Surface Mount Technology (SMT) solution and to develop rapid
prototyping setup from screen printing, soldering paste inspection,
pick-and-place to Automated Optical Inspection (AOI) systems. Besides
the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS)
solution is anticipated to complete in the next few weeks. The new China
Demo Center also includes equipment repair and refurbishment facilities.

“The opening of Kulicke and Soffa’s China Demo Center marks another
significant milestone for the Company. It further strengthen our strong
collaboration with customers and industry partners to develop and drive
next-generation packaging solutions in response to the industry’s
emerging opportunities,” said Fusen Chen, Kulicke and Soffa’s President
and Chief Executive Officer.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (

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